Responsibilities

Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in pressure / p-less sintering processes using film and paste materials.
Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process
Review engineering builds requirements and engineering instructions for new products
Responsible for reviewing, generating, updating, and approving specifications
Achieves operational objectives by contributing information and recommendations on new product releases
Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts

Qualifications

Education:

Masters/Degree of Materials, Chemical, Mechanical, Electronics, Electrical Engineering and/or BS Physics.
Experience
More than fifteen (15) years experience in New Package Development for semiconductor applications in leadframe substrates(QFN, MQFP, TQFP, SOIC, TSSOP, PDIP, and others) with sintering processes expertise.
Experience in GaN (dicing/assembly/ DA/flip chip) processing is an advantage

Skills:

Strong skills in DOE (Design of Experiments), 7QC Tools, SPC, Data Analysis, Control Plan, FMEA, 8D, RCCA, Problem Solving, Decision Analysis, Rheology, material science and process engineering
Strong English communication skills
Working knowledge on large scale, safe launch and pre-production releases (APQP)
Good interpersonal skills in collaborating with support groups
Highly motivated to work in a dynamic environment, with good integrity and character
Ability to multi-task and organize work systematically in meeting deadlines without compromising quality

Job Type: Full-time

Benefits:

Schedule:

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onsemi (formerly ON Semiconductor)