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About Us

SemiDice is the only die processor with a High Reliability Division dedicated to value added processing. This unique structure of our company has allowed us to focus on our customers’ specific requirements.

Whether your requirements are for generic devices or product tested and supplied to your source control drawings, SemiDice can react quickly to provide solutions. Each SemiDice facility is staffed with fully trained sales and technical personnel capable of supplying up-to-date information on product availability, component selection and product screening requirements. The corporate facility is equipped with ESD protected clean rooms, nitrogen stored inventory and complete technical libraries. Combined with strict AS9100 quality systems, our extensive inventory ensures quick delivery without compromise to quality.

SemiDice Hi Rel Division

Up to 12" wafer dicing, wafer inking/probing, Element Evaluation to Class H & K, component upscreening, testing to SCD’s, custom visual inspection & loading available.

Franchised/Authorized Lines

Both active and passive devices. Order die with complete confidence and manufacturer support.


Extensive Inventory

Thousands of different bare die part numbers from dozens of different semiconductor manufacturers.

Click here to search our inventory

Quick Quote Response

We are responsive to requests for quote and will get back to you promptly.

Click here to submit a request

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SemiDice Europe

SemiDice Europe was established to support demand for wafer and bare die components in the European marketplace. In concert with SemiDice, Inc. USA celebrating its 44th year of servicing the microelectronic industry, it ensures that we will be continuing to provide the highest level of quality and service on a global basis.


SDI Founded in 1976 to serve the special needs of bare die users

Close relationships with major Semiconductor Manufacturers

Specialists in understanding the

complex requirements of hybrid designers

Standard products division for

cost effective supply of commercial /industrial components

Hi Rel division for Military, Space, & Life Support applications

Well trained, long term employees (average >19 years)

Probe, ink, saw, die load, visual inspection, LAT’s,

inventory management,

JIT delivery and customized inventory programs

About SemiDice:

Since our beginning in 1976 the need for a company such as SemiDice, who can streamline the process of selling die for the semiconductor manufacturers and provide the level of service that is required by die users, has not changed. Our services have grown more extensive as device complexity and customer requirements have increased, however our goal remains the same: We strive to fully satisfy our customer requirements every time.

To do this effectively, we have two divisions within SemiDice; one for standard products and one for High Reliability devices. This allows us to be very aggressive on pricing for high volume commercial/industrial applications and also provide the highest levels of testing and qualification for defense/aerospace and life support applications where failure is not an option.

The SemiDice team members are talented, well trained individuals who are rewarded for their skill and dedication leading to an average tenure of 19 years of employment. Experience and knowledge are paramount in our industry.

Our capabilities include Source Control Drawing review, wafer inking/probing, dicing and packaging of the individual die components, visual inspection, test sample packaging, lot acceptance testing, inventory management, and just-in-time delivery.

We also manage services like tin whisker mitigation and packaged part Lot Acceptance Testing and screening. Our customers trust us to fully understand their requirements and satisfy them each and every time.

If you have component requirements that are complex or out of the ordinary SemiDice has a historical track record unmatched by others. We thrive on the difficult and challenging applications which translates into being the preferred global supplier of bare die components and wafer processing services.