Major Duties and Responsibilities:
Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in dicing, die attach (solder paste, epoxy, DAF), clip attach, reflow, defluxing or sintering processes. Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process Review engineering builds requirements and engineering instructions for new products Responsible for reviewing, generating, updating, and approving specifications Achieves operational objectives by contributing information and recommendations on new product releases Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts Education Degree of Materials, Mechanical, Electrical, Electronics, Chemical Engineering and/or BS Physics Experience More than five (5) years experience in New Product Introduction and/or Process Engineering in semiconductor assembly processes (die attach, clip attach, reflow, defluxing) for leadframe substrates (QFN, SOIC, TSSOP, and others) Experience in GaN (dicing/DA) and/or sintering processes is an advantage Skills: Strong skills in DOE (Design of Experiments), 7QC Tools, Data Analysis, Control Plan / FMEA, 8D and Problem Solving, Decision Analysis, Rheology, and material science Strong English communication skills Good interpersonal skills in collaborating with support groups Highly motivated to work in a dynamic environment, with good integrity and character Ability to multi-task and organize work systematically in meeting deadlines without compromising quality